5G Base Station for Satellite Communications

Overview

A new 5G base station physical layer reference design with Third Generation Partnership Project ("3GPP") Release 17 non-terrestrial network ("NTN") features.

  • 5G Base Station for Satellite Communications 0
Commercialisation opportunities
IP licensingTechnology co-development
Problem addressed

Extends the coverage of 5G networks to areas difficult to reach by ground-based stations, such as remote areas, oceans, and mountains

Innovation
  • 5G base station physical layer reference design supporting NTN features
  • Physical layer reference design based on CPU and FPGA designed and produced in Mainland China
Key impact
  • Bridging Global Connectivity Gap: Extends 5G network coverage to reach beyond traditional terrestrial limits and unlock innovation
  • Cost Saving: Reuses the already large-scale deployed 5G terrestrial network infrastructure and technology system, thereby reducing overall costs and improving deployment efficiency
  • Resilience: Provides backup connectivity in case of terrestrial network failures
  • Scalability: Enables seamless integration with 5G terrestrial networks.
Award
  • Nil
Application
  • Ubiquitous Connectivity in Remote Areas
  • Disaster Recovery and Emergency Services
  • Aeronautical and Maritime communications
  • Public Safety Networks and Global Supply Chain & Logistics

Patent

  • US App. No. 19/013.436
Hong Kong Applied Science and Technology Research Institute (ASTRI)

Hong Kong Applied Science and Technology Research Institute (ASTRI) was founded by the Government of the Hong Kong Special Administrative Region in 2000 with the mission of enhancing Hong Kong’s competitiveness through applied research. ASTRI’s core R&D competence in various areas is grouped under four Technology Divisions: Trust and AI Technologies; Communications Technologies; IoT Sensing and AI Technologies and Integrated Circuits and Systems. It is applied across six core areas which are Smart City, Financial Technologies, New-Industrialisation and Intelligent Manufacturing, Digital Health, Application Specific Integrated Circuits and Metaverse.

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