Hong Kong Applied Science and Technology Research Institute Company Limited (ASTRI) has developed a new electronics packaging technology platform with improved electrical, thermal and reliability performance for key power conversion modules in data centres and telecommunication equipment.
As effort to address the challenges of supplying ever increasing computing power using less energy in a smaller space with mission-critical reliability, ASTR has developed a new technology platform using Vertical-Driver-GaN and Package-Embedded Inductor technologies to improve the power density and the coupled electromagnetic-thermal performance concurrently for the critical power conversion modules in the next-generation data centres and telecommunication equipment.
Hong Kong Applied Science and Technology Research Institute (ASTRI) is founded in 2000 by the Government of the Hong Kong Special Administrative Region. As Hong Kong’s largest government-funded research and development centre, ASTRI is a key force and super connector driving innovation and technology advancement in Hong Kong, the Greater Bay Area, and the global innovation ecosystem. This role is strengthened through its merger with Nano and Advanced Materials Institute (NAMI).
Committed to bringing high impact research from lab to market, ASTRI advances interdisciplinary, market driven R&D that delivers practical innovations for industry and meaningful benefits for society.