Highly Efficient Power Converters for Data Centre and Telecommunication

Overview

Hong Kong Applied Science and Technology Research Institute Company Limited (ASTRI) has developed a new electronics packaging technology platform with improved electrical, thermal and reliability performance for key power conversion modules in data centres and telecommunication equipment.

  • Highly Efficient Power Converters for Data Centre and Telecommunication
Research completion
2019
Commercialisation opportunities
IP licensing; Technology co-development
Problem addressed

As effort to address the challenges of supplying ever increasing computing power using less energy in a smaller space with mission-critical reliability, ASTR has developed a new technology platform using Vertical-Driver-GaN and Package-Embedded Inductor technologies to improve the power density and the coupled electromagnetic-thermal performance concurrently for the critical power conversion modules in the next-generation data centres and telecommunication equipment.

Innovation
  • ~50% improvement of power density
  • ~2X improvement of driving speed
  • ~30% reduction of power loss & thermal resistance
  • ~3X improvement of reliability
Key impact
  • Power conversion for high-end applications
  • Fast driving speed for 3rd generation power semiconductors
  • Low power loss for energy saving
  • More reliable for a longer lifetime
Application
  • Data centres
  • 5G base station
  • Industrial control
  • Robotics 
Hong Kong Applied Science and Technology Research Institute (ASTRI)

The Hong Kong Applied Science and Technology Research Institute (ASTRI) was founded by the Government of the Hong Kong Special Administrative Region in 2000 with the mission of enhancing Hong Kong's competitiveness through applied research. ASTRI’s core R&D competence in various areas is grouped under five Technology Divisions: AI and Big Data Analytics; Communications; Cybersecurity, Cryptography and Trusted Technologies; Integrated Circuits and Systems; and IoT and Sensors. It is applied across five core areas which are Smart City, Financial Technologies, Intelligent Manufacturing, Digital Health, and Application Specific Integrated Circuits.

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