Self-Shutdown Li-ion Energy Storage Device for Explosion Prevention

Overview

Hong Kong Applied Science and Technology Research Institute Company Limited (ASTRI) has developed an Anti-Explosion Li-ion energy storage technology with build-in self-shutdown layer (SSL) design that safeguards energy storage device from thermal runaway.

  • Self-Shutdown Li-ion Energy Storage Device for Explosion Prevention
Research completion
2019
Commercialisation opportunities
IP licensing - Technology co-development
Problem addressed

As effort to safeguard lithium-Ion based energy storage device from potential fire hazard and explosion risks caused by overheating, ASTRI has developed a safety enhanced Li-ion energy storage technology with built-in self-shutdown design to greatly mitigate the hazardous risks and yield a more consummate and effective solution to protect environment, properties, and human lives.

Innovation
  • Thermal driven self-shutdown function to suppress overheating reaction and inhibit thermal runaway;
  • High porosity via the innovative design of shrinkable particles;
  • Environmental-friendly and low-cost process.
Key impact
  • Protect human life and properties with anti-explosion enhanced safety;
  • Promote electrification for carbon neutrality;
  • Boost industry 4.0.
Application
  • 3C
  • Robotics, Drone
  • Light electric-drive vehicle

Patent

  • US Patent No. 10,109,843
  • US Patent No. 10,608,226
Hong Kong Applied Science and Technology Research Institute (ASTRI)

The Hong Kong Applied Science and Technology Research Institute (ASTRI) was founded by the Government of the Hong Kong Special Administrative Region in 2000 with the mission of enhancing Hong Kong's competitiveness through applied research. ASTRI’s core R&D competence in various areas is grouped under five Technology Divisions: AI and Big Data Analytics; Communications; Cybersecurity, Cryptography and Trusted Technologies; Integrated Circuits and Systems; and IoT and Sensors. It is applied across five core areas which are Smart City, Financial Technologies, Intelligent Manufacturing, Digital Health, and Application Specific Integrated Circuits.

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